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New Generation of Position Sensors from NXP Improves Performance of Automotive Applications

8/1/2011

Unique magnetoresistive position sensors KMA210 developed on ABCD9

Eindhoven, The Netherlands, July 27, 2011 - NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the release of a new generation of automotive position sensors, KMA210. The KMA210 incorporates NXP's latest magnetoresistive sensor chip and a unique signal conditioning ASIC developed in NXP's advanced Silicon on Insulator (SOI) ABCD9 process technology. It is the first of a new magnetic sensor family in a full system-in-package solution that requires no external components. KMA210 is specially designed to improve the overall performance and increase robustness in automotive applications.

KMA210 is suitable for all automotive applications where a precise mechanical angle needs to be measured - from electronic steering and active suspension to automatic headlight adjustment. Due to its high accuracy and robustness the part is especially recommended for under-the-hood power train applications, throttle control and air control valve measurements. In addition, the sensor's robustness in high temperature ranges (up to 160ºC) makes it ideal for Exhaust Gas Recirculation (EGR) applications -- the heart and mind of emissions control.

NXP's magnetoresistive position sensors enable a safer, cleaner and more comfortable ride. To support global mandates to regulate CO2 in cars, KMA210 sensors can aid in the regulation of the engines untreated emissions. For example, in diesel engines, particle filter regeneration is assisted by throttling intake air which is needed to reduce the amount of emitted particulate mass. NXP's magnetoresistive position sensors enable ETC actuators to act as the load control and idle speed control unit in drive-by-wire engines, thus allowing a precise control of intake air and facilitating the additional implementation of cruise control or Electronic Stability Program (ESP) function.

By designing the Signal Conditioning ASIC in ABCD9, NXP's proprietary automotive grade Silicon on Insulator (SOI) technology based on 140 nm CMOS, the Electromagnetic Compatibility (EMC) performance is significantly improved compared to previous sensor products with integrated ASICs. The device contains two embedded capacitors within the same package which enables system cost reduction as no printed circuit boards or external filter components are required for operation. With respect to robustness, the KMA210 sensor is qualified according to the new HMM (Human Metal Model) and therefore extremely robust with excellent electrostatic discharge (ESD) behaviour. The sensors are fully temperature compensated and ready for use.

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