|
IMEC identifies hot spots in 3-D mixed IC stacks
7/15/2011 |
|
|
Nicolas Mokhoff
IMEC researchers have proven out that its 3-D design tools have the appropriate thermal models for designing next-generation 3-D stacked chips.
The 3-D stack resembles as close as possible to future commercial chips. It consists of IMEC's proprietary logic CMOS IC on top of which a commercial DRAM is stacked using through-silicon vias (TSVs) and micro-bumps.
Heaters were integrated to test the impact of hot spots on DRAM refresh times. And, the chip contains test structures for monitoring thermo-mechanical stress in a 3-D stack, ESD (electro-static discharge) hazards, electrical characteristics of TSVs and micro-bumps, fault models for TSVs, etc. IMEC's 3-D integrated DRAM-on-logic demonstrator showed that a minimum die thickness of 50?m is required to deal with local hot spots on the logic die, which are generated by local power dissipation.
Due to the strongly reduced lateral heat spreading capability of thin die, these hot spots are higher in temperature and more confined if the die thickness is reduced.
The hot spots on the logic die cause local temperature increases in the memory die. This may cause a reduction in retention time of the DRAM devices.
However, IMEC said that its 3-D stacked demonstrator has proven that the DRAM may not be thermally isolated from the logic die since the DRAM die also acts as an effective heat spreader for the logic die. As such the intensity of the hot spot is reduced and thereby the temperature rise in the DRAM device is strongly limited, according to the IMEC researchers.
The results of the various experiments allowed imec researchers to calibrate thermal models which are implemented in 3-D EDA tools. They have proven to be valuable means to design next-generation 3-D stacked ICs. The design of the 3-D chip is realized together with many players in the 3-D integration supply chain.
"This test-chip and our 3-D design tools and thermal models are an important step for the introduction of 3-D technology in DRAM-on-logic for mobile applications," said Luc Van den hove, president and CEO IMEC, said in a statement. He also added that "to boost the performance towards high-end applications, IMEC will set up a cooling research program."
The 3-D thermal work was executed in collaboration with partners Globalfoundries, Intel, Micron, Panasonic, Samsung, TSMC, Fujitsu, Sony, Amkor and Qualcomm.
|
|
|
|
|
|
主站蜘蛛池模板：
色丁香五月天|
野花香电视剧免费观看全集高清播放|
日韩深夜视频在线观看|
yy111111在线尤物|
久久精品第九区免费观看|
97国产视频|
日韩高清亚洲日韩精品一区二区三区|
亚洲AV日韩Aⅴ无码色老头|
9久9久热精品视频在线观看|
熟女无码|
国产成人精品午夜2022|
国产成人a∨激情视频厨房|
婷婷伊人綜合中文字幕小说|
激情内射人妻1区2区3区|
久久久久88色偷偷|
亚洲不卡av中文在线|
亚洲中文字幕一区二区|
亚洲成亚洲成网|
丝瓜视频成人|
国产精品人成视频免|
三年中文在线观看免费大全
|
久久久国产精品VA麻豆|
国产日韩久久免费影院|
人妻综合网|
东京热sese|
193尤物|
www深夜成人 a√在线|
亚洲成人小说|
亚洲色成人一区二区三区|
国产综合一区二区三区麻豆|
亚洲天堂视频在线观看|
日韩乱码人妻无码中文字幕
|
亚洲欧美日韩综合区|
国产成人精品日本亚洲专区6|
视频一区视频二区中文字幕|
中文字幕乱码亚洲美女精品|
苗栗市|
91一区二区三区蜜桃|
亚洲天堂久久一区av|
av一区二区中文字幕|
亚洲日本欧美日韩中文字幕|
